NTD3055-094G【PDF 1/9 页】MOSFET N-CH 60V 12A DPAK

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NTD3055-094, NVD3055-094

Power MOSFET

12 A, 60 V, N ? Channel DPAK / IPAK

Designed for low voltage, high speed switching applications in power

supplies, converters and power motor controls and bridge circuits.

Features

? Lower R DS(on)

? Lower V DS(on)

? Lower and Tighter V SD

? Lower Diode Reverse Recovery Time

? Lower Reverse Recovery Stored Charge

? NVD Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC ? Q101

Qualified and PPAP Capable

? These Devices are Pb ? Free and are RoHS Compliant

V (BR)DSS

60 V

http://onsemi.com

R DS(on) TYP

94 m W

N ? Channel

I D MAX

12 A

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

MARKING

DIAGRAMS

Rating

Drain ? to ? Source Voltage

Symbol

V DSS

Value

Unit

Vdc

Drain

Drain ? to ? Gate Voltage (R GS = 10 M W )

Gate ? to ? Source Voltage

? Continuous

? Non ? Repetitive (t p v 10 ms)

V DGR

V GS

" 20

" 30

Vdc

1 2

DPAK

CASE 369C

STYLE 2

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

Operating and Storage Temperature Range

I D

I DM

P D

T J , T stg

0.32

2.1

1.5

? 55 to

+175

Adc

Apk

W/ ° C

° C

IPAK

CASE 369D

STYLE 2

Gate

Drain

Source

Single Pulse Drain ? to ? Source Avalanche

Energy ? Starting T J = 25 ° C

(V DD = 25 Vdc, V GS = 10 Vdc, L = 1.0 mH

I L(pk) = 11 A, V DS = 60 Vdc)

Thermal Resistance

? Junction ? to ? Case

? Junction ? to ? Ambient (Note 1)

? Junction ? to ? Ambient (Note 2)

Maximum Lead Temperature for Soldering

Purposes, 1/8 ″ from case for 10 seconds

E AS

R q JC

R q JA

T L

3.13

71.4

100

260

° C/W

° C

55094

1 2 3

Gate Drain Source

= Device Code

= Year

= Work Week

= Pb ? Free Package

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommen-

ded Operating Conditions is not implied. Extended exposure to stresses above

the Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 0.5 sq in. pad size.

2. When surface mounted to an FR4 board using the minimum recommended

pad size.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 7 of this data sheet.

? Semiconductor Components Industries, LLC, 2013

April, 2013 ? Rev. 8

Publication Order Number:

NTD3055 ? 094/D

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